Semi-automatic Lithography Rack

Semi-automatic Lithography Rack
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Photolithography is a process used in microfabrication to transfer geometric patterns to a film or substrate. The importance of lithography can be appreciated in two ways. First, due to the large number of lithography steps needed in IC manufacturing, lithography typically accounts for about 30 percent of the cost of manufacturing. Second, lithography tends to be the technical limiter for further advances in feature size reduction and thus transistor speed and silicon area. Although lithography is certainly not the only technically important and challenging process in the IC manufacturing flow, historically, advances in lithography have gated advances in IC cost and performance.

Optical lithography is basically a photographic process by which a light sensitive polymer, called a photoresist, is exposed and developed to form three-dimensional relief images on the substrate. In general, the ideal photoresist image has the exact shape of the designed or intended pattern in the plane of the substrate, with vertical walls through the thickness of the resist. Thus, the final resist pattern is binary: Parts of the substrate are covered with resist while other parts are completely uncovered. This binary pattern is needed for pattern transfer since the parts of the substrate covered with resist will be protected from etching, ion implantation, or other pattern transfer mechanism.

The general sequence of processing steps for a typical photolithography process is as follows: substrate preparation, photoresist spin coat, prebake, exposure, post-exposure bake, development, and post-bake. Spinning the resist on the sample is done to create a uniform layer. Thus coating and baking the resist are crucial steps in a lithography process.

The main core of any lithography device is its exposure system. Because the minimum feature size that can be transferred with high fidelity to a resist film on the surface of the wafer is highly related to the wavelength of the light source. In this product the UV lamp is used to expose photoresist. Our company offers a product for integrating exposure system, spinner and heater in one device and enables customers to realize significantly reduced fabrication costs.

  • Fabrication of Integrated Circuits (IC), data storage devices, miniaturized sensors, MEMS and NEMS

Details of technical specifications are presented in the following Table.


To create a device layers of thin films have to be patterned, etched and coated. Lithography combines these processes and can create millions of devices in batch. Thus in order to create micrometer patterns in different substrates and subsequently create nanostructures, lithography has to be done.

  • Lithography must be done in cleanroom.
  • Put the specimen or mask inside the device using gloves and keep the inside chamber free from contaminants.
  • Before exposure and spinning, make sure the vacuum pump is on and the sample is kept on the holder.
  • For more details on how to use the device, refer to the device catalog and user guide.
  • During exposure, be sure to wear UV-protective glasses and do not stare at all.
  • During operation, keep your hair, hands and clothes away from mechanical parts.
  • Avoid moving the device when the heater is still hot.
  • Use forceps to put the specimen on the heater or to remove it.

Product Standard

  • Certificate of Nanotechnology

    Certificate of Nanotechnology

    Standard Date : 2018/08/22

    Expire Date : 2021/08/23

  • NanoScale Certification

    NanoScale Certification

    Standard Date : 2018/08/22

    Expire Date : 2021/08/23



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