Dip coater

Dip coater
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The Dip Coating which is perhaps the first and oldest coating technique mankind was acquainted with, is now known as the most common commercial method for coating deposition. Today, by sol-gel, or in general, other similar methods based on chemical solution, one can create efficient and abiding coating from a wide spectrum of materials such as; ferroelectric, dielectric, photoresists, polymers (especially for producing membranes), superconductive, passive, corrosion and oxidation protective materials onto the different substrates.
Of all thin film producing and coating methods, the dip coating is the most applicable, yet cost effective and straightforward technique which finds notable usage both in laboratorial and industrial scale. As a popular alternative to spin coating, dip coating methods are frequently employed to produce high quality thin films from sol-gel precursors for research purposes.
In the dip coating technique, the underlying mechanism consists of four steps which according to chronological order involve; first, a substrate to be coated is drawn beneath coating precursor solution bath to be fully soaked and wet by liquid medium for a while, second, as the substrate is about to be drawn out of the solution bath, the extra solution amount wetting the substrate slips off the surface and therefore only a thin layer of the solution remains in contact, and third, the thin layer of solution attached to the substrate outside the bath gradually loses its solvent, becomes dried, and is fully deposited onto the substrate surfaces. For the final step, a heat treatment regime is usually employed to crystallize and/or sintering the resulting coating.
Among all coating methods, the dip coating is one of those whose capabilities is much more suitable for nanoparticles multilayer deposition in the manner of layer by layer. This is because it enables each layer to be generated in separate interval, with quite different compositions, and therefore with completely distinct properties, functionalized for particular purpose.
Dip Coating is one of the most applicable, cost effective and straightforward technique used for centuries to deposit a wide spectrum of materials. Some of the today's applications are as follow;
  • Laboratory testing
  • Semiconductor Wafers
  • Photoresist
  • Sol-Gel deposition
  • Sensor
  • Field-effect transistor
  • LEDs
The specifications of the dip coater offered by the manufacturer have been presented in the Table.
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The resulting coating's structure from dip coating technique depends a great deal on the precursor solution in which the substrate is immersed. Therefore, by properly formulating the precursor solution purposefully (using nanoparticles suspension, for example), the desired coating's structures (nanostructured and/or nanocomposite, for example) would be easily achievable.
  • Locate the apparatus in the dry, clean and sliding-free place.
  • Avoid attaching objects weighing over 100g to the sample holder.
  • For the sake of convenient holding, the sample's size must be 6-10 mm higher than required for the coating purpose.
  • The laboratory's table upon which the apparatus is located must be fully aligned horizontally.
  • Note that the presence of dust and ash in the ambient air has adverse effects on the quality of the resulting coating.
  • Ensure proper position of apparatus for good ventilation.
  • While motor running, avoid touching the sample's holder.
  • Provide a power outlet allocated for the apparatus, and if necessary, another power outlet for vacuum pump.
  • Only use power supply with an output of 12V and 4A.

Product Standard

  • NanoScale Certification

    NanoScale Certification

    Standard Date : 2017/03/08

    Expire Date : 2020/03/07

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