Pulsed-Laser Deposition

Pulsed-Laser Deposition
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Pulsed-Laser Deposition (PLD) is a type of physical vapor deposition which uses thermal stimulation for evaporation, transfer, and deposition of Target atoms onto a substrate. Likewise other similar coating methods, the main components of this apparatus is composed of a Target (which dictates the composition of coating) and a substrate (to be coated) placed in a chamber connected to vacuum pumps, which, upon coating deposition, a laser beam is employed to thermally stimulate the Target. 
In this method, the heating mechanism involves a laser beam radiation and its focus on the Target surface. Laser focus causes the Target's surface temperature to locally rise beyond the melting and evaporation points. In consequence, a cloud of evaporated material takes shape which moves towards the substrate. For urging evaporated Target atoms to be preferably deposited onto the substrate, the substrate is usually heated. Though PLD is technically straightforward and has an acceptable reproducibility, it doesn’t necessarily mean that the underlying mechanisms responsible for coating deposition are readily traceable or fully known. Indeed, the reactions occurring inside the chamber could be much complex. It is because the striking of the laser beam onto the target surface, usually causes some other phenomena like scattering of electrons, ions, and molecules in addition to the Target evaporation. Consequently, the interaction of the laser beam with all these species causes the mechanisms inside the chamber to become much more complex. As a result, the optimum parameters finding for successful coating, often, is a matter of applying trial and error approach. The PLD also allows deposition of multi-components coatings like alloys (the composition of the vapor is dictated by the Target). In case of using active gases, it is possible to deposit oxide- and nitride-based coatings.
One of the main application of PLD is in the coating of some conductive and semi-conductive metal oxides. The other applications involve the coating of Nano oxide, metals, and diamond-like carbon (DLC). Despite this technique has successfully found notable application in the coating of a wide variety of materials, yet it is much more known as a laboratory facility capable of depositing high quality thin film for research and development of materials and new devices. 
Pulsed-laser deposition (PLD) is one of the most promising techniques for the formation of complex oxide hetero structures, super lattices, and well-controlled interfaces. The other applications include;
  • Electronic industry (transistors and diode fabrication)
  • MEMS industry
  • PMMA deposition before lithography
  • Chemical sensors fabrication
This company provide two equipment related to PLD: TEA-CO2 pulsed laser and CO2 Pulsed laser. The details have been listed in the table.
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Pulsed Laser Deposition (PLD) is one of the PVD coating Techniques which is able to produce thin film from a wide range of materials. Offering adjustable parameters, this apparatus can generate different internal structure such as microstructured, fine-grained, nanostructured, nanocomposite, etc. from a given material type.  
  • Ensure the proper connection of the earth cable (below 0.5 ohm). 
  • Ensure the proper placement of the apparatus for good ventilation. 
  • The location of the apparatus must be devoid of dust, ash and humidity as much as possible. 
  • For the operator's convenience, the space allocated to the apparatus inside the laboratory must be appropriate in respect to the apparatus' dimensions. 
  • Provide a space for installation of pump beneath the apparatus' table. 
  • Provide facility to make possible fastening the gas cylinders to the walls.
  • Anyone working with this apparatus must be properly trained and educated. 
  • Install the apparatus on the flat surface on the ground away from other electrical instruments. 
  • Check the integrity of electrical connectivity in high V cable
  • The apparatus' laboratory must be equipped with proper earth well for safe electrical discharge, otherwise, any case of personal injury or apparatus damage is not guaranteed. 
  • Avoid installation of the apparatus in those places with high risk of water leakage, otherwise the electrical shock or fire may be resulted. 
  • Never use gas pipes or telephones lines for purpose of earth connection. Inappropriate earth connection may cause to electrical shock. 
  • Never run the apparatus in places where the combustible gasses are present.

Product Standard

  • NanoScale Certification

    Standard Date : 2017/03/08

    Expire Date : 2020/03/07

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