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Spin Coating has been for several decades, and still is, one of the thin film coating deposition methods. Generally, this technique is used for layer deposition of sol-gels, photoresists, Nano particles and other chemicals. Very often, the coating is polymer-based and used in solution state. Usually, a small amount of coating precursor (resin, sol-gel, solution, etc.) is dropped in the center of substrate. The dropping could be either conducted in a dynamic or static way. Then by beginning the rotation of spin coater, a resulting centrifugal force becomes responsible for spreading the coating precursor over the entire substrate. The solvent usually used is volatile, and it evaporates simultaneous with the precursor spreading and the coating formation. As a rule, the more the spin coater's rotational speed, the thinner the resulting coating film.
One of the unique applications is the production of the thin film coatings from photo-sensitive organic material in different thicknesses, ranging from micrometric to nonmetric scale. In this coating technique, the two following steps have the most influential impact on the resultant coating thickness; the solvent evaporation and the substrate rotational speed. Besides, the thickness and other resultant thin film properties are dependent on resin's intrinsic features, viscosity, drying (dehydrating) rate, solid content percent, surface tension and parameters chosen for spinning process. Factors like rotational speed, acceleration and fume exhaust also help improve the coating homogeneity. Some of the important usage of the spinning coating include; Photoresist for pattering wafer in microcircuit production, Insulating layers for microcircuit fabrication such as polymers, Flat screen display coatings, Antireﬂection coatings, conductive oxide, DVD and CD rom, semiconductor Wafers and Sol-Gel deposition.
Spin coating technique is extensively being used for production of some Nano metric oxide layer thin film on glass and single crystals from sol-gel precursor. This technique is also used vastly in photolithography for deposition of 1-micrometer thickness photoresist layers.
Spin coating has been used for several decades for the application of thin films. Most substrates can be spin processed, including wafers, microscope slides, and photomasks. Some of its today's usages are;
- Photoresist for pattering wafer in microcircuit production
- Insulating layers for microcircuit fabrication such as polymers
- Flat screen display coatings
- Antireﬂection coatings and conductive oxide
- Semiconductor Wafers
- Sol-Gel deposition
- Conductive coating on large scale samples (wafers, compact discs, etc.)
- Multiple layer systems
- Conductive carbon films on specimens for X-ray microanalysis (EDX, WDX)
The specification of the spin coater apparatus offered by the manufacturer have been fully described in the Table.
Spin Coating is one of the most versatile and yet straightforward coating technique which enables coating from large group of materials. As other coating techniques, the spin coating depends on the coating precursor and the underlying parameters. Therefore if the coating precursor is purposefully prepared (using nanoparticles, for example) and the spin coating parameters is properly chosen, a coating with a desired structured like nanocomposite and/or nanostructured can be obtained.
- Use the proper power cable with UPS
- Provide an aspirator for organic solvents ventilation
- Only nearly symmetric planar substrates is permitted to be coated by this system, using other samples may result in the risk of throwing out them.
- Vacuum pump must be turned on, especially in the case of using high rotational speeds.
- Be careful that no-material moves inside the vacuum system.
- Never use acetone for cleaning of the apparatus, especially for O-rings beneath the sample.
- The laboratory table must be aligned horizontally for holding the apparatus.
- Note that high concentrations of dust and ash in air has adverse effects on coating quality.
- While layer deposition, remember that the main cap must remain closed.
- After finishing layer deposition, do not open the main cap unless the spinning of the substrate is ceased.
- While spinning, do not touch the substrate, it may causes serious damage to the apparatus.
- Never let any materials slip between the stationary and the rotating part, otherwise it causes a serious damage to the motor and electronic parts.
Standard Date : 2017/03/08
Expire Date : 2020/03/07