Spin Coater

Spin Coater
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For several decades, Spin Coating has been one of the thin film deposition methods. Generally, this method can be used for deposition of sol-gels, photoresists, nanoparticles and other chemicals. In most cases, the coating material is polymer-based and used in solution form. Usually, a certain amount of desired solution is poured onto the center of the substrate. Material injection in spin coating is usually performed by static or dynamic methods. Then by rotation of the substrate and generation of centrifugal force, coating material spread over the entire surface of substrate. The applied solvent is usually volatile and it evaporates at the same time as the coating is formed. As a rule, the higher spin speed in this technique produces the thinner film.
One of the unique applications of this device is the production of thin films of light-sensitive organic materials with different thicknesses, in the range of micrometers and nanometers. In this coating technique, the two following steps have the most influential impact on the resultant coating thickness; the solvent evaporation and the substrate rotational speed. Besides, final film thickness and other properties will depend on the nature of the resin, viscosity, drying rate, solids percentage, surface tension and the parameters chosen for the spin process. Coating uniformity also depends on factors such as spin speed, acceleration and solvent evaporation. Some of the main applications of this technique are production of photoresists for patterning of microcircuits wafers, insulating layers for fabrication of microcircuits, coatings of flat screen displays, antireflection coatings, conductive oxides, manufacturing of compact discs, semiconductor wafers and Sol-Gel deposition.
Spin coating technique is widely used to produce nanoscale oxide thin films on the glass and single crystals from sol-gel precursors. This technique is also used vastly in photolithography for deposition of photoresist layers with a thickness of about one micrometer.
For several decades, Spin Coating has been one of the thin film deposition methods. Most substrates, including wafers, microscope slides, and photomasks can be processed by this method. Some of its current applications are as follows:
  • Photoresist for pattering wafer in microcircuit production
  • Insulating layers for microcircuit fabrication such as polymers
  • Coatings of flat screen displays 
  • Antireflection coatings and conductive oxides
  • Semiconductor wafers
  • Sol-Gel deposition
  • Sensors
  • LEDs
  • Conductive coatings on the large scale samples (wafers, compact discs, etc.)
  • Multi-layer systems
  • Conductive carbon films on the specimens in X-ray microanalysis (EDX, WDX)
Details of technical specifications of spin coater device offered by manufacturer are presented in the following Table.
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Spin coating is one of the easy and efficient methods which can be used to deposit a variety of materials. Similar to other depositing methods, spin coating depends on the precursor and its basic parameters. Therefore, if the coating precursor is prepared purposefully (e.g. use of nanoparticles) and the coating parameters are chosen appropriately, coatings with desirable microstructures (e.g. nanocomposites or nanostructures) can be obtained.
  • Put the desired substrate onto the chuck center exactly.
  • Turn on the vacuum pump to completely hold the substrate on the chuck surface.
  • In the absence of proper vacuum, the solution may penetrate along the shaft as well as vacuum pump which can damage the device seriously.
  • Pour a few drops of the prepared solution onto the substrate.
  • Close the chamber door to avoid possible damages. 
  • After finishing the deposition process, turn off the vacuum pump to remove the sample.
  • To replace the holder fixture, pull it up vertically to separate from shaft; then put the fixture center onto the shaft and press it carefully to sit in its place.
  • For more details on how to use the device, refer to the device catalog and user guide.
  • To prevent possible damages or throwing objects from chuck, never open the device door while it is in operation.
  • To avoid electric shock, never dismantle or manipulate the device.
  • Never use the device without vacuum pump.

Product Standard

  • NanoScale Certification

    NanoScale Certification

    Standard Date : 2017/11/21

    Expire Date : 2020/11/21

  • Certificate of Nanotechnology

    Certificate of Nanotechnology

    Standard Date : 2017/11/21

    Expire Date : 2020/11/21

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